Package mold and semiconductor package processing procedure

• Main Authors: YANG, JIN-FENG, CHEN, BO-SYUN, CHEN, TANG-YUAN, LAI, JIN-YUAN
• Format: Patent
• Language: Chinese; English
• Published: 11.12.2018
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The invention relates to a package mold used for semiconductor package, including a first mold and a second mold. The first mold has an upper portion, at least a glue injecting mouth on the upper portion, an upper side portion connected with the upper portion, a first mold cavity formed between the upper portion and the upper side portion, and at least a first exhaust vent formed on the upper sideportion and passing through the upper side portion. The second mold has a lower portion, a lower side portion connected with the lower portion, a second mold cavity formed between the lower portion and the lower side portion, at least a second exhaust vent formed on the lower side portion and passing through the lower side portion, and a supporting portion which is in the second mold cavity and forms on the lower side portion. The supporting portion is used for supporting an object to be packaged. 本揭露有关于种用于半导体封装的封装模具，其包括第模具与第二模具。该第模具具有上部、设置于该上部的至少注胶口、与该上部连接的上侧部、形成于该上部和该上侧部之间的第模穴和形成于该上侧部且贯穿该上侧部的至少第排气孔。该第二模具具有下部、与该下部连接