Power module insulation adhesive pouring method, power module prepared by the method, and application of the method

• Main Authors: XU NINGHUA, LI LIANGXING, FENG HUIYU, ZENG XIONG, HE XINQIANG, LI HAN
• Format: Patent
• Language: Chinese; English
• Published: 07.12.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a power module insulation adhesive pouring method, a power module prepared by the method, and application of the method. The power module insulation adhesive pouring method includes the steps: improving the surface state of the power module by cleaning after completing soldering of a chip, a lining plate and a substrate of the power module; installing a tube cover on the soldered substrate, and setting the chip and the lining plate in a space surrounded by the tube cover and the substrate; injecting adhesive into the power module, wherein the thickness of the adhesive is enough to cover the substrate and the lower part of the chip, and exposing the surface of the chip; vacuuming the power module injected with the adhesive to break the bubbles in the adhesive; and performing adhesive solidification operation on the power module. In the power module insulation adhesive pouring method, the lining plate does not require additional pretreatment, thus having no demandfor adding extra time, c