Method and system for structural health monitoring of bonded joints
The invention provides a method and system for structural health monitoring of bonded joints by using guided waves. Structural health monitoring of adhesively bonded joints using guided waves determines the quality of adhesive bonds between two materials by injecting a high-frequency ultrasonic sign...
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| Main Authors | , |
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| Format | Patent |
| Language | Chinese English |
| Published |
04.12.2018
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| Subjects | |
| Online Access | Get full text |
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| Summary: | The invention provides a method and system for structural health monitoring of bonded joints by using guided waves. Structural health monitoring of adhesively bonded joints using guided waves determines the quality of adhesive bonds between two materials by injecting a high-frequency ultrasonic signal and measuring a characteristic of the ultrasonic waves which propagate through the adhesive, trapped and guided by the interfaces between the bonded materials and the adhesive. Prior to an inspection of an actual adhesively bonded structure, that structure is simulated using a finite element model, propagation of guided ultrasonic waves along the adhesive bond line is simulated to derive interface wave predicted properties. During ultrasonic inspection of the actual structure, interface wavemeasured properties are derived. The quality of the adhesive bond line is determined by comparing the empirical interface wave measured properties to simulated interface wave predicted properties.
提供了使用导波进行粘合接头的结构健康监测的方法和系统。所 |
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| Bibliography: | Application Number: CN201810367594 |