lead frame and method for manufacturing same

• Main Authors: KOBAYASHI KONOSUKE, ATO KOJI, TAKEUCHI MAKOTO
• Format: Patent
• Language: Chinese; English
• Published: 23.11.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a lead frame and a method for manufacturing the same. The lead frame comprises: a frame portion; a lead wire extending inward from the frame portion and having a front side anda back side; and an external connection terminal formed at a portion of the lead in the extending direction and protruding from the back surface of the lead. The lead wire includes a pentagonal shapecross section in the case where the lead face faces upward, and the pentagon shape has a quadrangular body portion and a triangular protrusion protruding from the lower surface of the body portion. The width of the lower end of the body portion is smaller than the width of the upper end of the body portion. 本发明提供种引线框架及其制造方法，引线框架包括：框架部分；引线，其从框架部分向内延伸并且具有正面和背面；以及外部连接端子，其形成于引线沿延伸方向的部分处并且从引线的背面突出。引线包括在引线的正面朝上的情况下的五边形形状的截面，五边形形状具有四边形的主体部分和从主体部分的下表面突出的三角形的突起部。主体部分的下端的宽度小于主体部分的上端的宽度。