Electroplating line copper ball adding device

• Main Authors: RAN XIANGJIN, ZUO CHUNRONG, MA YIJIN, HE MAOSHUI
• Format: Patent
• Language: Chinese; English
• Published: 23.11.2018
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention relates to an electroplating line copper ball adding device, which comprises a copper ball conveying device arranged above an electroplating tank, wherein the copper ball conveying device comprises a bracket and a conveying tank arranged on the bracket; the front end of the conveying tank is fixedly provided with a hopper; the side plate of one side of the conveying tank is providedwith a plurality of through holes through which a copper ball can pass; the side plate is also provided with a plurality of guide pipes by corresponding to the through holes; the guide pipes and the through holes are communicated for communicating the conveying tank and the electroplating tank; the bottom plate of the conveying tank is aslant arranged by facing the side plate provided with the through hole. According to the electroplating line copper ball adding device, electroplating efficiency and electroplating quality can be effectively improved. 本发明涉及种电镀线铜球添加装置，包括设置于电镀槽上方的铜球输送装置，所述铜球输送装置包括支架和设置于支架上的输送槽，所述输送槽的前端固定