PACKAGE STRUCTURE

• Main Authors: LU CHIENANG, LIN YI-HUNG, SUNG LI-WEI, WU CHENG-I, TING CHIN-LUNG, WANG CHENGI
• Format: Patent
• Language: Chinese; English
• Published: 13.11.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present disclosure provides a package structure including a redistribution layer and a die. The redistribution layer includes a switch circuit portion and a redistribution portion, the switch circuit portion includes a transistor, and the redistribution portion is adjacent to the switch circuit portion. The die overlaps the redistribution portion, wherein the transistor is electrically connected to the die. 本发明提供了种封装结构，其包括重分布层以及晶粒。重分布层包括开关电路部与重分布部，开关电路部包括晶体管，重分布部邻近于开关电路部，晶粒重迭于重分布部的至少部分，其中晶体管电连接晶粒。