ELECTROSTATIC ATTACHMENT CHUCK, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

• Main Authors: TERAKUBO YOSHIHIRO, MITSUI TAKAHIKO, YAMAMOTO EIICHI, ITO TOSHIHIRO
• Format: Patent
• Language: Chinese; English
• Published: 13.11.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention relates to an electrostatic attachment chuck and a method of manufacturing the same, and a method of manufacturing a semiconductor device. The present invention provides an electrostatic attachment chuck, a method of manufacturing the same, and a method of manufacturing the semiconductor device, which facilitates peeling of a semiconductor wafer and suppresses cracking of thesemiconductor wafer, and trims the semiconductor wafer with high precision to achieve thinness. The electrostatic attachment chuck that holds the semiconductor wafer by an electrostatic force has a substrate, a synthetic resin sheet bonded to one main surface of the substrate, and at least a pair of electrodes disposed inside the synthetic resin sheet; a planarized grinding surface for abutting the semiconductor wafer is formed on the surface of the synthetic resin sheet. Thereby, the semiconductor wafer can be adsorbed and held, and peeling can be easily performed, and damage at the time ofpeeling can be suppressed.