Method for line semi-embedding after electroplating fine lines on copper foil

• Main Authors: WU CHANGXIA, TANG ZIQUAN, MO XIKUN, JOE DICKSON, WU CHUANLIN
• Format: Patent
• Language: Chinese; English
• Published: 06.11.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention discloses a method for line semi-embedding after electroplating fine lines on copper foil. The method comprises the following steps of (S01) producing a copper foil carrier and electroplating lines on the copper foil; (S02) pasting a photosensitive film on a copper-clad plate to obtain an inner core plate; (S03) punching positioning holes in the inner core plate and the copper foil carrier; (S04) carrying out browning treatment on the etched copper foil carrier and the inner core plate; (S05) laminating the punched prepregs, inner core plate and copper foil carrier; (S06) dredging and removing prepreg frames by using a dredging machine and removing a hardness support layer on the copper foil carrier; (S07) drilling or laser drilling on the plate and baking after drilling; (S08) feeding electroless plating copper electroplating lines, removing glue and then carrying out electroless plating copper electroplating; (S09) carrying out printing and etching to remove base copperand to reserve hole copp