NEGATIVE TYPE PHOTOSENSITIVE COMPOSITION CURABLE AT LOW TEMPERATURE

The invention provides a negative type photosensitive composition curable at a low temperature and capable of forming a cured film excellent in transparency, in chemical resistance and in environmental durability, and also to provide a pattern-formation method employing the composition. The present...

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Bibliographic Details
Main Authors TANIGUCHI KATSUTO, MISUMI MOTOKI, KUZAWA MASAHIRO, YOKOYAMA DAISHI
Format Patent
LanguageChinese
English
Published 23.10.2018
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Summary:The invention provides a negative type photosensitive composition curable at a low temperature and capable of forming a cured film excellent in transparency, in chemical resistance and in environmental durability, and also to provide a pattern-formation method employing the composition. The present invention provides a negative type photosensitive composition comprising : an alkali-soluble resin,a compound having two or more (meth)acryloyloxy groups, a polysiloxane, a polymerization initiator, and a solvent. The alkali-soluble resin is a polymer comprising a carboxyl-containing polymerizationunit and an alkoxysilyl-containing polymerization unit. 提供种负型感光性组合物,所述负型感光性组合物可低温固化,并且可获得透明性、耐化学品性、耐环境性高的固化膜,还提供使用该组合物的图案形成方法。本发明提供种负型感光性组合物,其包含:碱可溶性树脂、具有2个以上的(甲基)丙烯酰氧基的化合物、聚硅氧烷、聚合引发剂、以及溶剂,所述碱可溶性树脂是含有包含羧基的聚合单元与包含烷氧基甲硅烷基的聚合单元的聚合物。
Bibliography:Application Number: CN201780011950