Light emitting diode package structure with surface light source, and manufacturing method thereof

The present invention provides a light-emitting diode (LED) package structure and a method for manufacturing the same. First, a ceramic substrate is provided. Then, an ultraviolet (UV) LED chip, a light-guiding layer, and a metal reflective layer are disposed on the substrate sequentially. By means...

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Bibliographic Details
Main Authors YE ZHI-TING, PAN XI-MING
Format Patent
LanguageChinese
English
Published 16.10.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention provides a light-emitting diode (LED) package structure and a method for manufacturing the same. First, a ceramic substrate is provided. Then, an ultraviolet (UV) LED chip, a light-guiding layer, and a metal reflective layer are disposed on the substrate sequentially. By means of the metal reflective layer, the emission light of the UV LED from the light-emitting side is reflected laterally and thus making the UV LED package structure output a plane light source. 本发明为种具面光源的发光二极管封装结构及其制造方法，其先提供陶瓷基板，再由紫外光发光二极管芯片、导光层与金属反射层依序设置于基板上，藉由金属反射层将紫外光发光二极管芯片于出光侧的光向侧边反射，因而让紫外光形成面光源。
Bibliography:Application Number: CN20171294290