PRINTED WIRING BOARD

The invention provides a printed wiring board with through hole conductive of high reliability. A central reducing part (24C) is formed in the joint of a first opening (24F) and a second opening (24S) which constitute a through hole (24) of a core substrate (30). Since central reducing part (24C) is...

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Bibliographic Details
Main Author HIBINO TOSHIAKI
Format Patent
LanguageChinese
English
Published 09.10.2018
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The invention provides a printed wiring board with through hole conductive of high reliability. A central reducing part (24C) is formed in the joint of a first opening (24F) and a second opening (24S) which constitute a through hole (24) of a core substrate (30). Since central reducing part (24C) is formed in the substantial center of the through hole (24), cavities may not left in the center part during electroplating, and the through hole conductor formed by electroplating and filling the through hole (24) is highly reliable. 本发明涉及印刷布线板，目的在于提供具备可靠性高的通孔导体的印刷布线板。在芯基板(30)的构成贯通孔(24)的第1开口(24F)与第2开口(24S)的接合处形成中央缩径部(24C)。由于在贯通孔(24)的大致中央部分形成了中央缩径部(24C)，因而在电镀时在中央部分不容易残留空孔，将贯通孔(24)进行电镀填充而成的通孔导体(36)的可靠性高。
Bibliography:Application Number: CN201810240773