High-performance colloid for aluminum-based copper-clad plate and preparation method of high-performance colloid

The invention relates to high-performance colloid for an aluminum-based copper-clad plate and a preparation method of the high-performance colloid. The high-performance colloid comprises, by mass percentage, 20-30% of resin matrix, 8-19% of curing agent, 9-21% of plasticizer, 1-2.1% of coupling agen...

Full description

Saved in:
Bibliographic Details
Main Authors LIANG YUCAI, XIN FENGGAO
Format Patent
LanguageChinese
English
Published 09.10.2018
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
Online AccessGet full text

Cover

More Information
Summary:The invention relates to high-performance colloid for an aluminum-based copper-clad plate and a preparation method of the high-performance colloid. The high-performance colloid comprises, by mass percentage, 20-30% of resin matrix, 8-19% of curing agent, 9-21% of plasticizer, 1-2.1% of coupling agent, 40-55% of filler and the balance organic solvent. The preparation method includes: preprocessingraw materials, preprocessing resin, performing curing agent mixing, adding the solvent, adding the coupling agent, adding the plasticizer, adding silicon powder, regulating viscosity, and emulsifyingfor standby. The high-performance colloid and the preparation method thereof have the advantages that the high-performance colloid is convenient in raw material acquiring, low in raw material and processing costs, small in toxic and side effects and simple in processing and production process, colloidal liquid production efficiency can be increased effectively, production cost can be lowered, thethermal coefficient, high-t
Bibliography:Application Number: CN201810491623