Method for manufacturing NLDMOS device and LDMOS (Laterally Diffused Metal Oxide Semiconductor) power device
The invention provides a method for manufacturing a full isolation type NLDMOS device and LDMOS (Laterally Diffused Metal Oxide Semiconductor) power device. The method comprises the steps of performing photoetching on a dielectric layer to remove an unnecessary dielectric layer to form a field effec...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
07.09.2018
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides a method for manufacturing a full isolation type NLDMOS device and LDMOS (Laterally Diffused Metal Oxide Semiconductor) power device. The method comprises the steps of performing photoetching on a dielectric layer to remove an unnecessary dielectric layer to form a field effect oxide layer; forming a P type well region and an N type well region; forming an N type drain driftregion and a P type drain drift region; forming a P type isolation structure located below the N type drain drift region and forming a P type isolation structure located below the P type drain driftregion, the doping concentration of the P type isolation structure located below the N type drain drift region being greater than the doping concentration of the P type isolation structure located below the P type drain drift region; and forming a grid structure on the field effect oxide layer. According to the method provided by the invention, the manufacturing process of a semiconductor device having a surface field effe |
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Bibliography: | Application Number: CN20181588308 |