POCKETED CIRCUIT BOARD

• Main Authors: SINSHEIMER ROGER ALLEN, PARRISH FRANK B, WADELL BRIAN C, DONOVAN BRIAN G, CREAGER BRANDON E, LYONS TIMOTHY DANIEL, VAYNER VLADIMIR
• Format: Patent
• Language: Chinese; English
• Published: 21.08.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

An example circuit board structure includes: a substrate; and vias that are electrically conductive and that pass through the substrate to enable electrical connection through the circuit board structure. The substrate is thinner, and lengths of the vias are shorter, in first areas of the circuit board structure that deliver first speed signals than in second areas of the circuit board structure that deliver second speed signals and power. The first speed signals have a shorter rise time than the second speed signals. 种实例电路板结构包括：基材；及通孔，所述通孔为导电的且通行穿过该基材以实现穿过该电路板结构的电气连接。相较于在该电路板结构的递送第二速度信号及电力的第二区域中，该基材在该电路板结构的递送第速度信号的第区域中较薄，且所述通孔的长度在该电路板结构的递送第速度信号的第区域中较短。所述第速度信号具有比所述第二速度信号更短的上升时间。