Preparation method of circuit board and circuit board

• Main Authors: SUN XUEBIAO, WU HUILAN, WANG YANG, JI SHENGPING, WU SHUANG
• Format: Patent
• Language: Chinese; English
• Published: 21.08.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention provides a preparation method of a circuit board and a circuit board. The method includes the following steps that: at least two boreholes spaced apart by a predetermined distance are formed in a metal substrate, wherein the metal substrate comprises a first surfaces and a second surface which are oppositely disposed, and the opening faces of the boreholes are located at the first surface of the metal substrate; a first insulating layer and a first metal layer are sequentially laminated on the first surface; and the metal substrate is thinned from a side where the second surfaceis located, so that the metal substrate can be divided into at least three separate metal blocks; and a second insulating layer and a second metal layer are sequentially laminated on the second surface. With the preparation method provided by the embodiments of the invention adopted to make the circuit board, processing precision is improved, the sizes of the metal blocks in the circuit board canbe consistent, the size of