Semiconductor cold and hot oven
The invention relates to a semiconductor cold and hot oven. The oven structurally comprises a pot body, a semiconductor chilling plate, an oven rack, a thermal insulation filling layer, a thermal insulation outer cover, an inner layer heat dissipation water pipe, an outer layer heat dissipation wate...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
21.08.2018
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Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to a semiconductor cold and hot oven. The oven structurally comprises a pot body, a semiconductor chilling plate, an oven rack, a thermal insulation filling layer, a thermal insulation outer cover, an inner layer heat dissipation water pipe, an outer layer heat dissipation water pipe, a power controller, a first temperature sensor and a second temperature sensor. The high heating efficiency characteristic of the semiconductor chilling plate is applied to manufacturing an efficient cooking pot which can replace a conventional civil gas stove, an electric cooker, an electromagnetic range, a microwave oven and other cooking heating devices, and the oven has the advantages of being clean and sanitary and facilitating environmental protection and is suitable for being applied and popularized. The semiconductor cold and hot oven has the multiple purposes of refrigerating and heating, and has the remarkable energy-saving effect, thermal loss is quite low, the heating speed is high, electric ene |
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Bibliography: | Application Number: CN201810468955 |