Thin film package structure, fabrication method thereof and display panel

• Main Author: GUO TIANFU
• Format: Patent
• Language: Chinese; English
• Published: 10.08.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a thin film package structure, a fabrication method thereof and a display panel. The thin film package structure comprises a first blocking layer, a micro particle layer, a buffer layer and a second blocking layer, wherein a carbon element is doped into the first blocking lay...