Thin film package structure, fabrication method thereof and display panel

• Main Author: GUO TIANFU
• Format: Patent
• Language: Chinese; English
• Published: 10.08.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a thin film package structure, a fabrication method thereof and a display panel. The thin film package structure comprises a first blocking layer, a micro particle layer, a buffer layer and a second blocking layer, wherein a carbon element is doped into the first blocking layer. A surface of the first blocking layer is modified by doping the carbon element into the first blocking layer, so that the micro particle layer can form a relatively contact angle on the surface of the first blocking layer, micro particles are prevented from being diffused in the surface of the first blocking layer and three-dimensional particles cannot be formed to develop an effect of an optical device, and the problem that the light giving-out efficiency cannot be improved is solved. 本发明公开了种薄膜封装结构及其制作方法和显示面板，薄膜封装结构包括第阻隔层、微颗粒层、缓冲层、第二阻隔层，其中，第阻隔层掺杂碳元素。通过在第阻隔层中掺杂碳元素，对第阻隔层的表面进行改性，使微颗粒层在第阻隔层的表面能够形成较大的接触角，避免了微颗粒在第阻隔层表面扩散以至于无法形成立体颗粒以发挥光学器件作用的情况，从而解决了无法提高出光效率的问题。