Nano-gap in-situ activated composite anodic bonding method

• Main Authors: PAN MINGQIANG, SUN LINING
• Format: Patent
• Language: Chinese; English
• Published: 10.08.2018
• Subjects: MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; TRANSPORTING

The invention discloses a nano-gap in-situ activated composite anodic bonding method, including a discharge activation process and an anodic bonding process. The composite anodic bonding method includes the following specific steps: setting a composite anodic bonding parameter; laminating a silicon...