EMBEDDED WIRE BOND WIRES FOR VERTICAL INTEGRATION WITH SEPARATE SURFACE MOUNT AND WIRE BOND MOUNTING SURFACES

• Main Authors: AWUJOOLA ABIOLA, LATTIN CHRISTOPHER W, DELACRUZ JAVIER A, PRABHU ASHOK S, SUN ZHUOWEN
• Format: Patent
• Language: Chinese; English
• Published: 03.08.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

In a vertically integrated microelectronic package, a first microelectronic device is coupled to an upper surface of a circuit platform in a wire bond-only surface area thereof. Wire bond wires are coupled to and extend away from an upper surface of the first microelectronic device. A second microelectronic device in a face-down orientation is coupled to upper ends of the wire bond wires in a surface mount-only area. The second microelectronic device is located above and at least partially overlaps the first microelectronic device. A protective layer is disposed over the circuit platform and the first microelectronic device. An upper surface of the protective layer has the surface mount-only area. The upper surface of the protective layer has the second microelectronic device disposed thereon in the face-down orientation in the surface mount-only area for coupling to the upper ends of the first wire bond wires. 在种垂直整合的微电子封装中，第微电子装置在该微电子封装的只有引线接合的表面区域中耦接至电路平台的上表面。引线接合线耦接至该第微电子装置的上表面，而且从该第微电子装置的该上表面延伸离开。处于面朝下的朝