Microdisplay module having a reduced size

• Main Author: PLETENETSKYY ANDRIY
• Format: Patent
• Language: Chinese; English
• Published: 31.07.2018
• Subjects: DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PHYSICS; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF

A microdisplay module (21) having a reduced size is disclosed. Conventional modules (e.g. of the LCOS type) require a large region of the package substrate (23) to accommodate and fix a flat flexiblecircuit connector (32) to them. The connector protrudes from the module in the same plane as the LCOS chip and the package substrate, additionally taking up significant space outside the module. In display systems with limited space there may be insufficient clearance, which can result in component failure and complicated assembly and testing. In the disclosed module, the flexible connector (32) is connected to the rear side of the package substrate (23). Electrical connection between the connector (32) and the module pads (28) on the front side are facilitated by via holes (29) passing through the substrate (23). The connector may be bent up around the edge of the package substrate to provide an improved clearance. 公开了种具有减小尺寸的微显示器模块(21)。常规模块(例如，LCOS型)要求封装基板(23)的较大区域进行容纳并且将平坦柔性电路连接器(32)连接到它们。与LCOS芯片和封装基板处于同平面中的来自模