Manufacturing method of resin sealing electronic component and manufacturing apparatus of resin sealing electronic component

• Main Authors: MIZUMA KEITA, YASUDA SHINSUKE, TAKADA NAOKI, NAKAMURA MAMORU, OKAMOTO ICHITARO, URAGAMI HIROSHI
• Format: Patent
• Language: Chinese; English
• Published: 31.07.2018
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The invention provides a manufacturing method of a resin sealing electronic component and a manufacturing apparatus of the resin sealing electronic component which enable a resin sealing electronic component having a plate like member to be easily manufactured at low costs. A resin sealing electronic component has a plate like member and a manufacturing method of the resin sealing electronic component formed by resin sealing an electronic component includes: a resin placement process where a resin is placed on the plate like member; a transfer process where the resin placed on the plate like member is transferred to a mold cavity of a mold; and a resin sealing process where the resin is compressively molded with the plate like member and the electronic component in a state where the electronic component is immersed in the resin 15 placed in the plate like member, thereby resin sealing the electronic component. 本发明提供种能够简便且以低成本制造具有板状构件的树脂封装电子元件的、树脂封装电子元件的制造方法及树脂封装电子元件的制造装置。所述方法是种对电子元件进行了树脂封装的树脂封装电子元件的制造方法，其特征在于