Composition for plating of substrate and plating method using the same

The present invention provides a composition for plating of a substrate and a plating method using the same, the composition for plating of a substrate comprising: an alkylammonium halide and more than one substance selected from a formaldehyde and an EO-PO copolymer. 本发明提供基板镀覆用组合物及利用该组合物的镀覆方法，所述基板镀...

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Bibliographic Details
Main Authors JIN-UK, LEE, HYE-LEE KIM, AE-RIM KIM, EUN-JUNG LIM, HAE-SUNG OH
Format Patent
LanguageChinese
English
Published 31.07.2018
Subjects
APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:The present invention provides a composition for plating of a substrate and a plating method using the same, the composition for plating of a substrate comprising: an alkylammonium halide and more than one substance selected from a formaldehyde and an EO-PO copolymer. 本发明提供基板镀覆用组合物及利用该组合物的镀覆方法，所述基板镀覆用组合物包括：烷基铵卤化物；以及从甲醛和环氧乙烷-环氧丙烷共聚物(EO-PO copolymer)中选择的种以上。
Bibliography:Application Number: CN201810052395