SEMICONDUCTOR DEVICE INCLUDING AN ENCAPSULATION MATERIAL DEFINING NOTCHES

• Main Authors: KHAI SEEN YONG, BALEHITHLU MANJAPPAIAH UPENDRA, KOK KIAT KOO
• Format: Patent
• Language: Chinese; English
• Published: 10.07.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor device includes a first contact element, a second contact element, a semiconductor chip, and an encapsulation material. The first contact element is on a first side of the semiconductor device. The second contact element is on a second side of the semiconductor device opposite to the first side. The semiconductor chip is electrically coupled to the first contact element and the second contact element. The encapsulation material encapsulates the semiconductor chip and portions of the first contact element and the second contact element. The encapsulation material defines at least two notches on a third side of the semiconductor device extending between the first side and the second side. 种半导体装置包括第接触元件、第二接触元件、半导体芯片和包封材料。所述第接触元件位于所述半导体装置的第侧。所述第二接触元件位于所述半导体装置的与所述第侧相反的第二侧。所述半导体芯片电耦合到所述第接触元件和所述第二接触元件。所述包封材料包封所述半导体芯片并包封所述第接触元件的部分和所述第二接触元件的部分。所述包封材料在所述半导体装置的于所述第侧与所述第二侧之间延伸的第三侧限定出至少两个凹口。