DIELECTRIC CLADDING OF MICROELECTROMECHANICAL SYSTEMS (MEMS) ELEMENTS FOR IMPROVED RELIABILITY

• Main Authors: SING, MOLLY NELIS, JACOBS, SIMON JOSHUA, TAYLOR, KELLY JAY
• Format: Patent
• Language: Chinese; English
• Published: 10.07.2018
• Subjects: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; TRANSPORTING

The invention relates to a dielectric cladding of microelectromechanical systems (MEMS) elements for improved reliability. In described examples, a method of forming a microelectromechanical device comprises: forming (102) a first metallic layer comprising a conducting layer on a substrate; forming (104) a first dielectric layer on the first metallic layer, wherein the first dielectric layer comprises one or more individual dielectric layers; forming (106) a sacrificial layer on the first dielectric layer; forming (108) a second dielectric layer on the sacrificial layer; forming (110) a secondmetallic layer on the second dielectric layer; and removing (112) the sacrificial layer to form a spacing between the second dielectric layer and the first dielectric layer. Removing the sacrificiallayer enables movement of the second dielectric layer relative to the first dielectric layer in at least one direction. 本申请涉及微机电系统(MEMS)元件的用于改善可靠性的介电包覆。在所描述的示例中，种形成微机电器件的方法包括：在衬底上形成(102)包括导电层的第金属层；在第金属层上形成(104)第介电层，其中第介电层包括个或多