Device for processing silicon ring and processing method

• Main Authors: BAI DUJUAN, KU LIMING, BAI GELING, XIA QING, ZHU QINFA, YAN ZHIRUI, LI LEI
• Format: Patent
• Language: Chinese; English
• Published: 29.06.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a device for processing a silicon ring and a processing method. The device comprises a chamfering disc and a driving device, wherein the chamfering disc rotates under the driving of the driving device. The method for processing a silicon ring by adopting the device comprises the steps of (1) installing the chamfering disc on a rotating device, and coating the chamfering disc with grinding mortar; (2) chamfering an inner circle of the silicon ring, and adjusting the edge shape of the inner circle through adjusting the autorotation speed and grinding time of the chamfering disc; and (3) cleaning the silicon ring. Chamfering is performing on the inner circle of the silicon ring according to the device and processing method disclosed by the invention, thereby being simple to implement and high in efficiency, and greatly reducing the processing time of the inner circle. 本发明公开了种用于加工硅环的装置及加工方法。该装置包括倒角盘和驱动装置，倒角盘在驱动装置的驱动下进行旋转。采用所述装置加工硅环的方法包括以下步骤：(1)将倒角盘安装在转动装置上，在倒角盘上涂上研磨砂浆；(2)对硅环内圆进行倒角，通过调整倒角盘的