Methods for making chemical mechanical planarization (CMP) polishing pads having integral windows
The present invention provides methods of making a chemical mechanical planarization (CMP) polishing layer or pad comprising providing an open mold having a surface with a female topography that generates a flat or shaped CMP polishing layer surface and having held in place thereon one or more endpo...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
26.06.2018
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention provides methods of making a chemical mechanical planarization (CMP) polishing layer or pad comprising providing an open mold having a surface with a female topography that generates a flat or shaped CMP polishing layer surface and having held in place thereon one or more endpoint detection window pieces; mixing a liquid isocyanate component with a liquid polyol component toform a solvent free reaction mixture; spraying the reaction mixture onto the open mold while the one or more window pieces is held in place, with each window piece at a predefined location, followed by curing the reaction mixture.
本发明提供了制造化学机械平面化(CMP)抛光层或抛光垫的方法,其包含:提供敞口模具,其具有带有会产生平的或成形的CMP抛光层表面的凹形貌的表面并且具有保持在其上适当位置的或多个终点检测窗口片;将液体异氰酸酯组分与液体多元醇组分混合,形成无溶剂反应混合物;将所述反应混合物喷射到所述敞口模具上,同时将所述或多个窗口片保持在适当位置,每个窗口片位于预先确定的位置,接着固化所述反应混合物。 |
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Bibliography: | Application Number: CN201711179988 |