Electronic component and process of producing electronic component

• Main Authors: FRECKMANN DOMINIQUE, GULSOY GOKCE, SCHMIDT HELGE, MATHEWS BARRY C, SONEJA SHALLU, LEIDNER MICHAEL, SACHS SOENKE, BHARADWAJ LAVANYA, OAR MICHAEL A
• Format: Patent
• Language: Chinese; English
• Published: 08.06.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

Electronic components (100) and processes of producing electronic components are disclosed. The electronic component includes a substrate (101) and a thermal grain modified layer (103) positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed. 公开了电子部件(100)和生产电子部件的方法。所述电子部件包括衬底(101)和位于衬底上的热晶粒改性层(103)。热晶粒改性层包括改性的晶粒结构。改性的晶粒结构包括热晶粒改性添加剂。还公开了种用于形成电子部件的方法。