METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

A method for manufacturing a wiring board (1) having a conductor (3) that includes at least lead lines (5) and a shield (7) that is wider than the lead lines (5), said method comprises a first conductor formation step (ST10) for forming the lead lines (5) and forming a boundary line (9) correspondin...

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Bibliographic Details
Main Authors AOSHIMA SHINSUKE, KOSHIMIZU KAZUTOSHI
Format Patent
LanguageChinese
English
Published 08.06.2018
Subjects
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
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Summary:A method for manufacturing a wiring board (1) having a conductor (3) that includes at least lead lines (5) and a shield (7) that is wider than the lead lines (5), said method comprises a first conductor formation step (ST10) for forming the lead lines (5) and forming a boundary line (9) corresponding to at least the section of the outline (71) of the shield (7) proximate to the lead lines (5); anda second conductor formation step (ST20) for forming the main body (8) of the shield (7). 种具有至少包括引出线(5)和宽度宽于引出线(5)的屏蔽部(7)的导体部(3)的配线基板(1)的制造方法，具备：形成引出线(5)、和与屏蔽部(7)的轮廓(71)中的至少靠近引出线(5)的部分对应的分界线(9)的第导体部形成工序(ST10)；以及形成屏蔽部(7)的主体部(8)的第二导体部形成工序(ST20)。
Bibliography:Application Number: CN201680056976