ELECTRICAL COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL COMPONENT OF THIS TYPE

• Main Author: STUTE GEORG
• Format: Patent
• Language: Chinese; English
• Published: 08.06.2018
• Subjects: ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR; PHYSICS; SEMICONDUCTOR DEVICES; TARIFF METERING APPARATUS; TESTING

The invention relates to an electrical structural member, which comprises a first package and a second package. The first package has a first connection frame, a chip disposed in the first connectionframe, and a first encapsulation material encapsulating the chip and at least portions of the first connection frame. The second package has a second connection frame and a second encapsulation material encapsulating at least portions of the second connection frame. The first encapsulation material is securely connected to the second encapsulation material. 本发明涉及种电气结构构件，其具有第封装体，所述第封装体具有第连接框架、以及装配到所述第连接框架的芯片、以及包封所述芯片和所述连接框架的至少部分的包封材料，其中第二封装体具有第二连接框架、以及包封所述连接框架的至少部分的包封材料，其中所述第封装体的包封材料牢固地连接到所述第二封装体的包封材料。