ULTRA-LOW DEFECT PART PROCESSING

The invention relates to ultra-low defect part processing. A method for removing and preventing defects on surfaces of a component of a substrate processing chamber includes loading the component intoa vacuum chamber and, with the component loaded within the vacuum chamber, baking the component at a...

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Bibliographic Details
Main Authors MARY ANNE PLANO, IAN SCOT LATCHFORD
Format Patent
LanguageChinese
English
Published 08.06.2018
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Summary:The invention relates to ultra-low defect part processing. A method for removing and preventing defects on surfaces of a component of a substrate processing chamber includes loading the component intoa vacuum chamber and, with the component loaded within the vacuum chamber, baking the component at a baking temperature during a first predetermined period to remove water and defects from the surfaces of the component, and purging the component within the vacuum chamber during at least one second predetermined period to remove the defects from the vacuum chamber. 本发明涉及超低缺陷部件处理。种用于去除和防止衬底处理室的组件的表面上的缺陷的方法包括:将所述组件装载到真空室中;并且,在所述组件被装载在所述真空室内的情况下,在第预定时间段期间在烘烤温度下烘烤所述组件以从所述组件的表面去除水和缺陷,以及在至少个第二预定时间段期间清扫所述真空室内的所述组件以从所述真空室中除去所述缺陷。
Bibliography:Application Number: CN201711079849