INLAY electronic tag chip packaging experimental machine

• Main Author: CHENG MINGMING
• Format: Patent
• Language: Chinese; English
• Published: 01.06.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

The invention relates to an INLAY electronic tag chip packaging experimental machine. The INLAY electronic tag chip packaging experimental machine includes a machining platform, the machining platformis equipped with a load material carrier, an upper hot press head, a lower hot press head, a mounting plate, a first driving mechanism, a second driving mechanism, and pressure fine adjustment mechanisms for adjusting the space between the mounting plate and the first driving mechanism and detecting pressure. The experimental machine also includes a control panel, and the upper hot press head, the lower hot press head, the first driving mechanism and the second driving mechanism are all electrically connected to the control panel and controlled by the same. The load material carrier clamps asubstrate, then an electronic tag chip is placed on the substrate, the first driving mechanism drives the upper hot press head to move downward, the second driving mechanism drives the lower hot presshead to move upward, and h