Megasonic electroplating device for improving metal microelectroforming uniformity and method

• Main Authors: ZHAI KE, ZHAO WENJUN, ZHAO WEN, WANG WEITAI, DU LIQUN, ZHU HEQING
• Format: Patent
• Language: Chinese; English
• Published: 11.05.2018
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention provides a megasonic electroplating device for improving metal microelectroforming uniformity and a method. Bi-directional alternate megasonic waves are coupled in the electroplating process. The device comprises a megasonic plating tank, and the megasonic plating tank comprises piezoelectric ceramic groups, an electroplating tank, a waterproof tank and a water bath; the electroplating tank is fixed in the waterproof tank by sticking to the wall; the waterproof tank is positioned in the water bath and is fixed to the water bath through an upper cover plate which is integral withthe waterproof tank; the piezoelectric ceramic groups are pasted outside the two side walls of the electroplating tank; the electroplating tank is made from a quartz material; the wall thickness of the electroplating tank is the half-wave length of utilized megasonic frequency in quartz; and megasonic signals are introduced into the piezoelectric ceramic groups, and time control of bi-directionalmegasonic vibration is ach