Multi-camera module

• Main Author: WEI YOUXING
• Format: Patent
• Language: Chinese; English
• Published: 08.05.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PICTORIAL COMMUNICATION, e.g. TELEVISION; SEMICONDUCTOR DEVICES

The embodiment of the invention discloses a multi-camera module. The multi-camera module comprises a naked chip, a package substrate, a module substrate and a plastic layer; a side bonding pad is arranged at the outside of the package substrate, and a welding material is arranged on the side bonding pad; the periphery size of the package substrate is greater than the size of the naked chip, and the size difference between the package substrate and the naked chip is not more than a preset threshold; the naked chip is arranged on the package substrate, and a function pin of the naked chip is connected to the side bonding pad by using a semiconductor lead process so as to form a package chip; the package chip is adhered on the surface of the module substrate, and is connected with the weldingbonding pad of the module substrate through the side bonding pad of the package chip; the plastic layer is arranged at a non-photosensitive region of the camera module. The multi-camera module disclosed by the application av