Positioning mechanism for laser processing and laser processing system

• Main Authors: LIAN ZHIXIAN, SHI RUI, HONG JUEHUI, ZHANG JINJUN, ZHANG YUNZHI, THOMAS EDWARD NIELSEN, CHEN YAN, WANG TIANYU, SONG JINJIANG, TIAN JINGDANG, LI XUDONG
• Format: Patent
• Language: Chinese; English
• Published: 04.05.2018
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention provides a positioning mechanism for laser processing and a laser processing system. The positioning mechanism comprises a bearing element, a primary positioning unit and a precise positioning unit, wherein at least one positioning part for holding a workpiece is arranged on the bearing element; the primary positioning unit is used for taking the workpiece and conveying the workpieceto the positioning part; the precise positioning unit comprises a visual camera; the visual camera is used for collecting an outer contour image of the workpiece on the positioning part. The positioning mechanism uses the primary positioning and precise positioning modes for positioning the workpiece; the position of the workpiece is more precise; the positioning time is shortened; the processingefficiency is improved. 本发明提供了种激光加工用定位机构以及激光加工系统，包括承载件、初定位单元和精定位单元，承载件上具有至少个用于放置工件的定位部，初定位单元用于将工件抓取并输送至定位部处，精定位单元包括视觉相机，视觉相机用于采集位于定位部上的工件外轮廓图像。该定位机构采用初定位和精确定位的方式对工件进行定位，工件的位置更加精确，且缩短了定位时间，提高了加工效率。