Full-automatic bending attachment assembly device and method

• Main Authors: BAI ZHIFEI, XIE LIGANG
• Format: Patent
• Language: Chinese; English
• Published: 27.04.2018
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The invention belongs to the field of 3C attachment assembly, and provides a full-automatic bending attachment assembly device and method. The device comprises a material supply mechanism, a materialtaking mechanism, a feeding mechanism, an n-shaped support, a bending mechanism and a material collection mechanism. The material supply mechanism is arranged behind the n-shaped support. The materialtaking mechanism is arranged at the rear end of a cross beam of the n-shaped support to do back and forth movement. The feeding mechanism is arranged at the front end of the cross beam of the n-shaped support to do back and forth movement. The bending mechanism is arranged below the n-shaped support and does back and forth movement between the material taking mechanism and the feeding mechanism.The material collection mechanism is arranged in front of the bending mechanism and corresponds to the lower portion of the feeding mechanism. According to the full-automatic bending attachment assembly device and method, a fil