Cutting fluid cooling and filtering system for silicon wafer cutting machine

• Main Authors: CHEN HAO, YIN DEJUN, ZHU DEYI
• Format: Patent
• Language: Chinese; English
• Published: 20.04.2018
• Subjects: CHEMISTRY; FUELS; LUBRICANTS; LUBRICATING COMPOSITIONS; METALLURGY; PEAT; PERFORMING OPERATIONS; PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; TRANSPORTING; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATINGINGREDIENTS IN A LUBRICATING COMPOSITION; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

The invention discloses a cutting fluid cooling and filtering system for a silicon wafer cutting machine. The cutting fluid cooling and filtering system comprises a filtering system and a cooling device, a cutting fluid inlet is formed in the upper portion of the left side of the filtering system, a filtering sieve is arranged in the filtering system, the filtering system is provided with a filterresidue pump arranged above the filtering sieve, the filter residue pump is electrically connected with a control device through a conducting wire, the filter residue pump communicates with a filterresidue tank through a filter residue pipeline, a filter residue outlet is formed in the middle of the lower portion of the filter residue tank, supporting legs are installed at the two ends of the lower portion of the filter residue tank, rollers are arranged below the supporting legs, a braking device is arranged on one side above each roller, and a cooling coil is arranged in the lower portionof the interior of the cool