RESIN MOLDING DEVICE AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE

• Main Authors: TAKASE SHINJI, KAWAKUBO KAZUKI, OKUNISHI YOSHITO
• Format: Patent
• Language: Chinese; English
• Published: 17.04.2018
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Provided is a resin molding device capable of suppressing variations in the thickness of a resin molded article. A resin molding device 10 is provided with: a first platen 11 and a second platen 12 (outer peripheral load platens) that are two plate-shaped members arranged in parallel and between which a molding mold 16 is arranged in a mold arrangement part 1611, which is a central part of the plate-shaped members; a force application part (a toggle link 133 and tie bars 132) that applies a force from load points 171 and 172 outside the mold arrangement part 1611 to the first platen 11 and thesecond platen 12; a heating mechanism (a lower heater plate 151 and an upper heater plate 152) provided between the outer peripheral load platens and the molding mold 16; and heat insulation members(a lower heat insulation member 141 and an upper heat insulation member 142) each of which includes a plurality of elastic column-shaped members 14A arranged between the respective outer peripheral load platen and the heating