A high-integration and small-size collecting and compiling device
The invention provides a high-integration and small-size collecting and compiling device comprising a high-density assembled circuit module and a power module, wherein the high-density assembled circuit module is connected with the power module and the power module is used for providing power for th...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
10.04.2018
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides a high-integration and small-size collecting and compiling device comprising a high-density assembled circuit module and a power module, wherein the high-density assembled circuit module is connected with the power module and the power module is used for providing power for the high-density assembled circuit module. The high-density assembled circuit module comprises a signal conditioning module, a collection and processing module and a wireless communication module. The signal conditioning module performs signal processing on voltage signals and temperature signals to obtain multi-channel analog signals; the collection and processing module selects analog signals of corresponding channels, converts the same to digital signals and compiles the digital signals into corresponding data frames to obtain compiled frame data; the wireless communication module transmits the compiled frame data. The collecting and compiling device employs the integrated fusion design, sothat the weight of the c |
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Bibliography: | Application Number: CN201711048723 |