WAFER CARRIER HAVING A DOOR WITH A UNITARY BODY

• Main Authors: BANDREDDI MURALI, FULLER MATTHEW A
• Format: Patent
• Language: Chinese; English
• Published: 27.03.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The preesnt invention discloses a front opening wafer carrier. The front opening wafer carrier comprises: a container portion. The container portion includes a top wall, a bottom wall, a pair of sidewalls, a back wall, and a door frame opposite the back wall, the door frame defining a front opening, and a door removably received in the door frame for closing the front opening. The door has a single body construction and a substantially smooth exterior surface including one or more automation interface receiving features having a minimal volume, which may minimize the amount of oxygen that canbe trapped between the wafer carrier door and an equipment front end module when the wafer carrier is in use. 本发明揭示种前开口晶片载体，其包含：容器部分。所述容器部分包含顶部壁、底部壁、对侧壁、后壁及与所述后壁相对的门框，所述门框界定前开口；及门，其可移除地接纳于所述门框中用于封闭所述前开口。所述门具有单个主体构造及包含具有最小体积的或多个自动化接口接纳特征的基本上平滑外表面，当所述晶片载体在使用中时所述基本上平滑外表面最小化可陷留于所述晶片载体门与设备前端模块之间的氧的量。