Function module heat dissipation structure and case

• Main Authors: FENG LIANG, XIAO XIANGYU, YU FEI
• Format: Patent
• Language: Chinese; English
• Published: 27.03.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention relates to the technical field of communication network equipment and in particular relates to a function module heat dissipation structure and a case. The function module heat dissipation structure disclosed by the invention comprises a power amplifier base board used for being mounted on the case, wherein a PCB (Printed Circuit Board) with a power amplifier module is connected ontothe power amplifier base board; a power amplifier shell covers the PCB; a protruding part is arranged on the outer edge of the power amplifier shell and extends along a board surface direction of thePCB, and the extension direction of the protruding part is far away from the center of the shell; and the protruding part simultaneously extends to inner walls of the case and is contacted with the inner walls of the case. According to the function module heat dissipation structure, the structural form of the existing circuit system is changed, so that effective heat transfer is performed betweenthe circuit system and the