Manufacturing method of product substrate and circuit board adopting product substrates

• Main Authors: MIN YUNSHENG, LIU JINGLING
• Format: Patent
• Language: Chinese; English
• Published: 16.03.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention belongs to the circuit board process manufacturing technical field and relates to a manufacturing method of a product substrate and a circuit board adopting the product substrates. The method comprises the following steps that: a pre-patterned metal template and a non-metal insulating medium are provided; the metal template is arranged in a special mold, and the non-metal insulatingmedium is applied onto the upper surface and lower surface of the metal template; and the non-metal insulating medium is melt, so that the non-metal insulating medium covers the metal template, so that the product substrate can be formed. With the method adopted, steps of etching and electroless plating copper on a metal template such as a copper plate can be avoided, and therefore, production efficiency can be improved, the quality of a formed circuit substrate is more stable; and a user can select metal templates of corresponding thicknesses, and therefore, the operating current demand of acircuit board can be satis