Circuit support for an electronic circuit, and method for manufacturing a circuit support of said type

The invention relates to a circuit support for an electronic circuit, comprising: - at least one conductor path (22); - an insulating matrix made of a first insulating material (17) that is injection-molded over the at least one conductor path (22) in such a way as to leave open at least one first r...

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Bibliographic Details
Main Authors HELBIG PETER, SEIFRITZ SVEN, SZEKELY JOZSEF, SCHOWEL MICHAEL
Format Patent
LanguageChinese
English
Published 02.03.2018
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The invention relates to a circuit support for an electronic circuit, comprising: - at least one conductor path (22); - an insulating matrix made of a first insulating material (17) that is injection-molded over the at least one conductor path (22) in such a way as to leave open at least one first region (15) for connecting at least one electronic component (14) of the electronic circuit; - and aheat sink (18); the first insulating material (17) is injection-molded over the at least one conductor path (22) in such a way that the insulating matrix (16) also leaves open at least one second region (34) located between the conductor path (22) and the heat sink (18); the circuit support further comprises a plurality of spacers (28; 36) which are designed and placed in such a way as to adjust aheight (h1) of the second region (34) between the conductor path (22) and the heat sink (18); the circuit support also comprises a second insulating material (24) with which the second region (34) isfilled. The invention furt
Bibliography:Application Number: CN201680031667