Method of making polishing layer for chemical mechanical polishing pad

• Main Authors: BRUGAROLAS BRUFAU, TERESA, LUGO, DIEGO, DEGROOT, MARTY W, QIAN, BAINIAN, VENEZIALE, DAVID MICHAEL, YEH, FENGJI, JACOB, GEORGE C, TONG, YUHUA, MILLER, JEFFREY B, KOZHUKH, JULIA, WANK, ANDREW
• Format: Patent
• Language: Chinese; English
• Published: 16.02.2018
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

A method of forming a chemical mechanical polishing pad polishing layer is provided, including: providing a mold having a base with a negative of a groove pattern; providing a poly side (P) liquid component; providing an iso side (I) liquid component; providing a pressurized gas; providing an axial...