Method of making polishing layer for chemical mechanical polishing pad

• Main Authors: BRUGAROLAS BRUFAU, TERESA, LUGO, DIEGO, DEGROOT, MARTY W, QIAN, BAINIAN, VENEZIALE, DAVID MICHAEL, YEH, FENGJI, JACOB, GEORGE C, TONG, YUHUA, MILLER, JEFFREY B, KOZHUKH, JULIA, WANK, ANDREW
• Format: Patent
• Language: Chinese; English
• Published: 16.02.2018
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

A method of forming a chemical mechanical polishing pad polishing layer is provided, including: providing a mold having a base with a negative of a groove pattern; providing a poly side (P) liquid component; providing an iso side (I) liquid component; providing a pressurized gas; providing an axial mixing device; introducing the poly side (P) liquid component, the iso side (I) liquid component andthe pressurized gas to the axial mixing device to form a combination; discharging the combination from the axial mixing device at a velocity of 5 to 1,000 m/sec toward the base; allowing the combination to solidify into a cake; deriving the chemical mechanical polishing pad polishing layer from the cake; wherein the chemical mechanical polishing pad polishing layer has a polishing surface with the groove pattern formed into the polishing surface; and wherein the polishing surface is adapted for polishing a substrate. 提供种形成化学机械抛光垫抛光层的方法，其包括：提供具有基底的模具，所述基底具有凹槽图案的阴纹；提供聚侧(P)液体组分；提供异侧(I)液体组分；提供加压气体；提供轴向混合装置；将所述聚侧(P)液体组分、所