APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES

An apparatus for processing wafer-shaped articles comprises a rotary chuck having a series of contact elements surrounding a wafer-shaped article when mounted on the rotary chuck. A non-rotating plateis positioned interiorly of the series of contact elements. The plate includes a gas supply that is...

Full description

Saved in:
Bibliographic Details
Main Authors BERNHARD LOIDL, MICHAEL BRUGGER, SHIHUNG KON, MILAN PLISHA
Format Patent
LanguageChinese
English
Published 13.02.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:An apparatus for processing wafer-shaped articles comprises a rotary chuck having a series of contact elements surrounding a wafer-shaped article when mounted on the rotary chuck. A non-rotating plateis positioned interiorly of the series of contact elements. The plate includes a gas supply that is configured to supply gas so as to support a wafer-shaped article without contacting the non-rotating plate according to the Bernoulli principle. 本发明涉及种用于处理晶片状物品的装置，其包括：旋转卡盘，当晶片状物品被安装在旋转卡盘上时，该旋转卡盘具有围绕晶片状物品的系列接触元件。非旋转板位于系列接触元件的内部。该板包括气体供应装置，所述气体供应装置构造成供应气体，以便根据伯努利原理，在不接触非旋转板的情况下支撑所述晶片状物品。
Bibliography:Application Number: CN201710659207