One-step method for preparing epoxy resin with low viscosity, high strength and high toughness

The invention discloses a one-step method for preparing epoxy resin with low viscosity, high strength and high toughness. The one-step method comprises the following step: subjecting raw materials toa curing reaction so as to prepare the epoxy resin with high strength and high toughness, wherein the...

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Bibliographic Details
Main Authors ZOU QI, CHENG JUE, ZHANG JUNYING, BA LONGHAN
Format Patent
LanguageChinese
English
Published 30.01.2018
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Summary:The invention discloses a one-step method for preparing epoxy resin with low viscosity, high strength and high toughness. The one-step method comprises the following step: subjecting raw materials toa curing reaction so as to prepare the epoxy resin with high strength and high toughness, wherein the raw materials comprise the following components in percentages by weight: 38 wt% to 59 wt% of matrix resin, 38 wt% to 59 wt% of a curing agent and 0.1 wt% to 3 wt% of an accelerant; the matrix resin is a mixture of epoxy resin and an active diluent; the active diluent is a weak polar epoxy compound with a side chain; the temperature of curing is 70 to 160 DEG C; and the time of curing is 3 to 8 hours. According to the invention, cured epoxy resin with high tensile strength, high tensile modulus and good toughness is prepared by the one-step method through the following steps: adding a proper amount of weak polar low-viscosity epoxy resin so as to obtain a low-viscosity epoxy resin component, then carrying out mixi
Bibliography:Application Number: CN20161585646