LED (light-emitting diode) ceramic package material for LED package

The invention discloses an LED (light-emitting diode) ceramic package material for package. The material is prepared from, by weight, 10-20 parts of Nano-MgO, 5-10 parts of Cr2O3, 5-20 parts of Ba(OH)2, 4-12 parts of NaOH, 5-8 parts of KOH, 3-4 parts of Al(OH)3, 8-10 parts of CuCl2, 50-90 parts of m...

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Bibliographic Details
Main Author CHEN RUIQIONG
Format Patent
LanguageChinese
English
Published 30.01.2018
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Summary:The invention discloses an LED (light-emitting diode) ceramic package material for package. The material is prepared from, by weight, 10-20 parts of Nano-MgO, 5-10 parts of Cr2O3, 5-20 parts of Ba(OH)2, 4-12 parts of NaOH, 5-8 parts of KOH, 3-4 parts of Al(OH)3, 8-10 parts of CuCl2, 50-90 parts of montmorillonite nano-powder, 10-15 parts of calcium carbonate, 7-9 parts of medical stone powder and10-12 parts of vermiculite powder. The LED ceramic package material for package is low in manufacturing cost, excellent in distribution performance and reasonable in component blending, the wavelengthadjusted by the reflectance curve peak value of a finished product formed by blending the components is approximate to 400nm, a strong absorption peak is arranged in an ultraviolet region and matchedwith visual characteristics of human eyes, and the luminous efficiency of the LED material can be improved. 本发明公开了种用于封装用的LED陶瓷封装材料,其由以下原料按照下述重量份数通过煅烧的方式制备而成:10-20份Nano-MgO、5-10份CrO、5-20份Ba(OH)、4-12份NaOH、5-8份KOH、3-4份Al(OH)、8-10
Bibliography:Application Number: CN201710753698