Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indium

Iridium electroplating compositions containing 1,10-phenanthroline compounds in trace amounts to electroplate substantially defect-free uniform and smooth surface morphology indium on metal layers. The indium electroplating compositions can be used to electroplate indium metal on metal layers of var...

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Bibliographic Details
Main Authors FLAJSLIK, KRISTEN, QIN, YI, LEFEBVRE, MARK
Format Patent
LanguageChinese
English
Published 26.01.2018
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:Iridium electroplating compositions containing 1,10-phenanthroline compounds in trace amounts to electroplate substantially defect-free uniform and smooth surface morphology indium on metal layers. The indium electroplating compositions can be used to electroplate indium metal on metal layers of various substrates such as semiconductor wafers and as thermal interface materials. 含有痕量1,10-啡啉化合物的铟电镀组合物在金属层上电镀基本上无缺陷的均和平滑表面形态铟。所述铟电镀组合物可用于在如半导体晶片的各种衬底的金属层上电镀铟金属和用作热界面材料。
Bibliography:Application Number: CN20171521605