Embedded substrate

• Main Authors: WANG JUNHE, LIAO XIAOJING, PENG HAO
• Format: Patent
• Language: Chinese; English
• Published: 19.01.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to the technical field of integrated circuits, and discloses an embedded substrate. The embedded substrate is used for solving a problem that an embedded substrate limits the further improvement of the packaging integration degree in the prior art because all chips of the embedded substrate occupies a bigger space and the reliability of products is lower. The embedded substrate comprises a substrate, wherein two sides of the substrate in the thickness direction are respectively provided with at least one first cavity and at least two first electronic devices, and each first electronic device is corresponding to one first cavity; packaging layers which are respectively disposed in each first cavity and respectively wrap the first electronic devices in the first cavities, and is provided with a plurality of first connection holes, wherein each first connection hole is corresponding to one pin of one first electronic device, and is connected with a corresponding pin;and a conductive circuit